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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX4100A/D Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated The Motorola MPX4100A/MPXA4100A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on-chip integration makes the Motorola MAP sensor a logical and economical choice for automotive system designers. The MPX4100A/MPXA4100A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * 1.8% Maximum Error Over 0 to 85C * Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems * Temperature Compensated Over -40C to +125C * Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package Application Examples * Manifold Sensing for Automotive Systems * Ideally suited for Microprocessor or Microcontroller- Based Systems * Also Ideal for Non-Automotive Applications MPXA4100A6U CASE 482 SMALL OUTLINE PACKAGE MPX4100A MPXA4100A SERIES INTEGRATED PRESSURE SENSOR 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.8 Volts Output UNIBODY PACKAGE MPX4100A CASE 867 MPX4100AP CASE 867B VS SENSING ELEMENT THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY Vout MPXA4100AC6U CASE 482A MPX4100AS CASE 867E PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE GND PINS 4, 5 AND 6 ARE NO CONNECTS FOR UNIBODY DEVICE PIN NUMBER 1 2 3 4 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C 1 2 3 PIN NUMBER Vout Gnd VS 4 5 6 N/C N/C N/C Figure 1. Fully Integrated Pressure Sensor Schematic REV 5 NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. NOTE: Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Motorola Sensor (c) Motorola, Inc. 2001 Device Data 1 MPX4100A MPXA4100A SERIES MAXIMUM RATINGS(NOTE) Parametrics Maximum Pressure (P1 u P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 400 -40 to +125 -40 to +125 Units kPa C C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Supply Range(1) Symbol POP VS Io (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR Io+ -- -- Min 20 4.85 -- 0.225 4.870 -- -- -- -- -- -- -- Typ -- 5.1 7.0 0.306 4.951 4.59 -- 54 1.0 0.1 20 0.5 Max 105 5.35 10 0.388 5.032 -- 1.8 -- -- -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.1 Volts Full Scale Output(4) @ VS = 5.1 Volts Full Scale Span(5) @ VS = 5.1 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Offset Time(8) Stability(9) NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Weight, Basic Element (Case 867) Weight, Small Outline Package (Case 482) Typ 4.0 1.5 Unit grams grams 2 Motorola Sensor Device Data MPX4100A MPXA4100A SERIES FLUORO SILICONE GEL DIE COAT P1 WIRE BOND LEAD FRAME +5 V DIE STAINLESS STEEL CAP THERMOPLASTIC CASE 1.0 mF 0.01 mF Vs IPS GND 470 pF Vout OUTPUT ABSOLUTE ELEMENT SEALED VACUUM REFERENCE DIE BOND Figure 2. Cross Sectional Diagram SOP (not to scale) Figure 3. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 2 illustrates the absolute sensing chip in the basic chip carrier (Case 482). 5.0 4.5 4.0 OUTPUT (Volts) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 Pressure (ref: to sealed vacuum) in kPa 0 MIN TRANSFER FUNCTION: Vout = Vs* (.01059*P-.152) Error VS = 5.1 Vdc TEMP = 0 to 85C 20 kPa TO 105 kPa MPX4100A MAX TYP Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C. The output will saturate outside of the specified pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4100A/MPXA4100A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Motorola Sensor Device Data 3 MPX4100A MPXA4100A SERIES Transfer Function (MPX4100A, MPXA4100A) Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.1518) +/- (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V 0.25 Vdc Temperature Error Band MPX4100A, MPXA4100A Series 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 Temp - 40 0 to 85 +125 Multiplier 3 1 3 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C. Pressure Error Band 3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 - 2.0 - 3.0 Pressure 20 to 105 (kPa) Error (Max) 1.5 (kPa) 20 40 60 80 100 120 Pressure (in kPa) Error Limits for Pressure 4 Motorola Sensor Device Data MPX4100A MPXA4100A SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola MPX Part Number MPX4100A MPX4100AP MPX4100AS MPXA4100A6U/T1 MPXA4100AC6U Case Type 867 867B 867E 482 482A Stainless Steel Cap Side with Port Marking Side with Port Attached Stainless Steel Cap Side with Port Attached pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier ORDERING INFORMATION -- UNIBODY PACKAGE MPX Series Device Type Basic Element Ported Elements Options Absolute, Element Only Absolute, Ported Absolute, Stove Pipe Port Case Type 867 867B 867E Order Number MPX4100A MPX4100AP MPX4100AS Device Marking MPX4100A MPX4100AP MPX4100A ORDERING INFORMATION -- SMALL OUTLINE PACKAGE Device Type Basic Element Options Absolute, Element Only Absolute, Element Only Ported Element Absolute, Axial Port Case No. 482 482 482A MPX Series Order No. MPXA4100A6U MPXA4100A6T1 MPXA4100AC6U Packing Options Rails Tape and Reel Rails Marking MPXA4100A MPXA4100A MPXA4100A Motorola Sensor Device Data 5 MPX4100A MPXA4100A SERIES INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) 6 Motorola Sensor Device Data MPX4100A MPXA4100A SERIES UNIBODY PACKAGE DIMENSIONS C R M B -A- N PIN 1 SEATING PLANE 1 2 3 4 5 6 POSITIVE PRESSURE (P1) NOTES: 10. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 11. CONTROLLING DIMENSION: INCH. 12. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _NOM 0.475 0.495 0.430 0.450 0.090 0.105 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _NOM 12.07 12.57 10.92 11.43 2.29 2.66 L -T- G F D 6 PL 0.136 (0.005) M J S TA M STYLE 1: PIN 1. 2. 3. 4. 5. 6. VOUT GROUND VCC V1 V2 VEX STYLE 2: PIN 1. 2. 3. 4. 5. 6. OPEN GROUND -VOUT VSUPPLY +VOUT OPEN STYLE 3: PIN 1. 2. 3. 4. 5. 6. CASE 867-08 ISSUE N BASIC ELEMENT T R SEATING PLANE A U L V NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. MILLIMETERS MIN MAX 29.08 29.85 17.4 18.16 7.75 8.26 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.1 23.11 BSC 4.62 4.93 VOUT GROUND VCC V1 V2 VEX N Q B 1 2 3 4 5 6 Q K S P C J 0.25 M PIN 1 P TQ M G F 6X D 0.173 DIM A B C D F G J K L N P Q R S U V M TP S Q S STYLE 1: PIN 1. 2. 3. 4. 5. 6. CASE 867B-04 ISSUE F PRESSURE SIDE PORTED (AP, GP) Motorola Sensor Device Data 7 MPX4100A MPXA4100A SERIES UNIBODY PACKAGE DIMENSIONS--CONTINUED C A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N S V INCHES MIN MAX 0.720 0.690 0.245 0.255 0.780 0.820 0.027 0.033 0.178 0.186 0.048 0.064 0.100 BSC 0.014 0.016 0.345 0.375 0.300 0.310 0.220 0.240 0.182 0.194 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 17.53 18.28 6.22 6.48 19.81 20.82 0.69 0.84 4.52 4.72 1.22 1.63 2.54 BSC 0.36 0.41 8.76 9.53 7.62 7.87 5.59 6.10 4.62 4.93 -B- V PIN 1 PORT #1 POSITIVE PRESSURE (P1) 6 5 4 3 2 1 K S G F D 6 PL M J N E -T- 0.13 (0.005) TB M VOUT GROUND VCC V1 V2 VEX CASE 867E-03 ISSUE D PRESSURE SIDE PORTED (AS, GS) 8 Motorola Sensor Device Data MPX4100A MPXA4100A SERIES SMALL OUTLINE PACKAGE DIMENSIONS -A- 5 4 D 8 PL 0.25 (0.010) M TB S A S -B- 8 G 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 10.29 10.54 18.01 18.41 S N C H -T- K M PIN 1 IDENTIFIER SEATING PLANE J CASE 482-01 ISSUE O -A- 5 4 D 8 PL 0.25 (0.010) M TB S A S N -B- 8 G 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -T- SEATING PLANE CASE 482A-01 ISSUE A Motorola Sensor Device Data 9 MPX4100A MPXA4100A SERIES Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 Technical Information Center: 1-800-521-6274 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2, Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 HOME PAGE: http://www.motorola.com/semiconductors/ 10 Motorola Sensor Device Data MPX4100A/D |
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